[Prev][Next][Index]
[Fwd: Hot Chips Advance program flyer info - long form]
- From: "Alvin R. Lebeck" <alvy@cs.duke.edu>
- Newsgroups: duke.cs.os-research
- Subject: [Fwd: Hot Chips Advance program flyer info - long form]
- Date: Mon, 29 Jun 1998 12:53:01 -0400
- Organization: Duke University Department of Computer Science
- Sender: alvy@cs.duke.edu
- Xref: news.duke.edu duke.cs.os-research:201
This is a multi-part message in MIME format.
--------------4647623079E7D16E8354CD54
Content-Type: text/plain; charset=us-ascii
Content-Transfer-Encoding: 7bit
--------------4647623079E7D16E8354CD54
Content-Type: message/rfc822
Content-Transfer-Encoding: 8bit
Content-Disposition: inline
Received: from mail2.digital.com (mail2.digital.com [204.123.2.56])
by duke.cs.duke.edu (8.8.5/8.8.5) with ESMTP id FAA14942
for <alvy@cs.duke.edu>; Wed, 24 Jun 1998 05:39:43 -0400 (EDT)
Received: from raquet.pa.dec.com (raquet.pa.dec.com [16.2.96.1])
by mail2.digital.com (8.8.8/8.8.8/WV1.0f) with SMTP id CAA06272;
Wed, 24 Jun 1998 02:32:17 -0700 (PDT)
Received: from terrapin.pa.dec.com by raquet.pa.dec.com (5.65v3.2/1.1.10.5/07Nov97-1157AM)
id AA04140; Wed, 24 Jun 1998 02:32:06 -0700
Mime-Version: 1.0
X-Sender: abaum@raquet.pa.dec.com
Message-Id: <v04011728b1b67199527e@[16.2.96.162]>
Date: Wed, 24 Jun 1998 02:39:24 -0700
To: abaum@pa.dec.com
From: "Allen J. Baum" <abaum@pa.dec.com>
Subject: Hot Chips Advance program flyer info - long form
Content-Transfer-Encoding: 8bit
X-MIME-Autoconverted: from quoted-printable to 8bit by duke.cs.duke.edu id FAA14942
Content-Type: text/plain; charset="iso-8859-1"
========================================
Sunday August 16
========================================
Morning Tutorial:
Intellectual Property Law as Applied to the Computer and Electronics Industries
Margaret Jane Radin
William Benjamin Scott & Luna M. Scott Professor of Law
Stanford Law School
The tutorial will outline the basics of the traditional forms of legal
protection of intellectual property (patents, trademarks, copyrights and
trade secrets) and describe some of the issues posed by developments in
information technology and the global networked environment. We will
consider how intellectual property protection is established, how it
functions in practice, and what happens when intellectual property rights
are infringed. We will look at not only the different principles of each
form of protection, but also how their boundaries are delineated, and where
those boundaries are blurred (e.g. copyright vs. patenting of software.)
We will also consider how economic factors relate to the extent of
intellectual property protection, and we will consider the significance of
non-property (the public domain) for the competitive marketplace and for
future invention.
========================================
Afternoon Tutorial
Fast CPUs Are Good ... but Fast I/O is Better
Speaker: Silicon Graphics Peripherals Team
Fast microprocessors need large storage and fast I/O. This tutorial
will include overviews of various I/O technologies, how they fit togehter,
and where they seem to be going, including peripheral connections, disks,
removables, and performance issues.
1) Overview of the various technologies, how they fit together,
and where they are going.
2) Survey of peripheral connections, e.g. SCSI, FibreChannel, 1394
3) Disk technologies
History, specifications, technologies, capacities, bandwidths,
latencies
Fixed and removables
Near-term futures
4) CDROMs, DVD, etc
5) Tapes
6) Real problems or "your mileage may vary"
Peak numbers vs. real numbers
real case studies of extreme I/O demands
========================================
Monday August 17
9:00-9:15 Welcome, Opening remarks (General and Program Chairs)
========================================
9:15-10:45 Session 1: High Performance Processors (part 1) John Mashey, chair
The Alpha 21264 Microprocessor: Out-Of-Order Execution at 600 Mhz
R. E. Kessler,Digital Equipment Corporation
UltraSPARC-III: A 600 MHz 64-bit Superscalar Processor for 1000-way
Scalable Systems
Gary Lauterbach, Sun Microsystems, Inc.
Techniques for Mitigating Memory Latency in the PA-8500 Processor
David Johnson, Hewlett-Packard
10:45-11:15 Break
===================================================
11:15-12:15 Session 2: Embedded and Embeddable Processors Kazuaki
Murakami, chair
The M32Rx/D - A Single Chip Microcontroller With a 4MB Internal DRAM
Toru Shimizu, Mitsubishi Electric Corporation
Genesis microprocessor
Jack Choquette, SandCraft Inc.
12:15-1:30 Lunch
===================================================
1:30-2:15 Session 3: Monica Lam chair
Keynote: Greg Papadopoulos, Chief Technology Officer, Sun Microsystems
2:15-2:30 Short break
===================================================
2:30-4:00 Session 4:Specialized Chips Alan Smith ,chair
Designing a Single Chip Chess Grandmaster While Knowing Nothing about Chess
Feng-hsiung Hsu, IBM T. J. Watson Research Center
An Encryption Accelerator and Coprocessor
Mark Birman, Hi/fn
The EMU10K1 Digital Audio Processor
Tom Savell E-mu Systems, Inc.
4:00-4:30 Break
========================================
4:30-6:00 Session 5:High Performance Processors (part 2) Marc
Tremblay ,chair
IBM S/390 G5 Microprocessor
Timothy J. Slegel, Robert M. Averill III, Mark A. Check,
Bruce C. Giamei, Barry W. Krumm, Christopher A. Krygowski, Wen H. Li,
John S. Liptay, John D. MacDougall, Thomas J. McPherson,
Jennifer A. Navarro, Eric M. Schwarz, Kevin Shum, and Charles F. Webb,
IBM Corporation
A CMOS Vector Processor with Custom Streaming Cache
Greg Faanes, Cray Research
AltiVec(tm) Technology: Accelerating Media Processing Across the Spectrum
Keith Diefendorff*, Pradeep Dubey**, Ron Hochsprung*, Brett Olsson**,
Hunter Scales*** (*Apple Computer, **IBM, ***Motorola)
========================================
6:00-7:30 Dinner
7:30-9:00 Session 6: Panel: Can Microsoft be Stopped? John Wharton, chair
Panellists: TBA
Microsoft's hold on the industry keeps growing. Are there any fronts --
business, technology, content or legal -- where the company may be
vulnerable?
========================================
Tuesday August 18
========================================
9:00-10:30 Session 7: MPEG and Digital TV Gert Slavenburg, chair
A Single-chip MPEG2 MP@ML Video Encoder with Multi-chip Configuration for a
Single-board MP@HL Encoder
Toshihiro Minami, Toshio Kondo, Koyo Nitta, Kazuhito Suguri,
Mitsuo Ikeda, Takeshi Yoshitome, Hiroshi Watanabe, Hiroe Iwasaki,
Katsuyuki Ochiai, Jiro Naganuma, Makoto Endo, Eiichi Yamagishi,
Takuro Takahashi, Koichi Tadaishi, Yutaka Tashiro, Naoki Kobayashi,
Tsuneo Okubo, Takeshi Ogura, Ryota Kasai, NTT
TM2000: A Single-Chip DTV Media Processor from Trimedia
Selliah Rathnam and Gerrit Slavenburg, Trimedia Product Group
A New Chipset for DTV Compliant with ATSC Standard
Hee-Bok Park, Cheol-Kyo Suh, Seung-Jong Choi, Dong-Il Han,
Jin-Gyeong Kim, Dae-Hyup Ko, Jong-Seok Park, LG Electronics Inc.
10:30-11:00 Break
===================================================
11:00-12:30 Session 8: General Puropose Processors with Integrated Media
Support Kunle Olukotun, chair
A High Performance x86 Processor with Integrated 3D Graphics
Rich Perego, Cyrix Corporation
Novel Multimedia Instruction Capabilities in VLIW Media Processors
J.T.J. van Eijndhoven, Philips Research Laboratories Eindhoven,
F. W. Sijstermans, Eindhoven University of Technology
SA-1500: A 300 MHz RISC CPU with Attached Media Processor
Prashant P. Gandhi, Intel Corp.
12:30-2:00 Lunch
===================================================
2:00-4:00 Session 9: Graphics Accelerators Bill Dally, chair
Intel i740 Graphics Accelerator
Tom Piazza, Intel Corp.
Blitzen: Lightning Speed 3D Geometry Accelerator
Alan Krech, Hewlett-Packard
Neon: A (Big) (Fast) Single-Chip 3D Graphics Accelerator
Joel McCormack, Robert McNamara, Christopher Gianos, and Norman
Jouppi, Digital Equipment Corporation;
Larry Seiler and Ken Correll, Mitsubishi Electric Research Laboratory
VelaTX - Innovative 3D Architecture Coupled with Embedded DRAM Architecture
Michael C. Lewis, Joseph C. Del Rio, Stellar Semiconductor, Inc.
4:00-4:30 Break
===================================================
4:30-5:30 Session 10: High Performance PC Processors Ruby Lee, chair
AMD 3DNow! Technology and the K6-2 Microprocessor
Stuart Oberman, Fred Weber, Norbert Juffa, Greg Favor, AMD
TBA
5:30-5:40 Closing Remarks
===================================================
Organizing Committee Program Committee
-------------------- -----------------
Chair Program Co-Chairs
Allen Baum Compaq John Wawrzynek U.C. Berkeley
Vice Chair Norm Jouppi Compaq
S. Diane Smith Santa Clara Univ
Finance Program Committee
Lily Jow Compaq Bill Dally Stanford Univ.
Publicity Monica Lam Stanford Univ.
Cynthia Garb GHI Ruby Lee Hewlett Packard
Registration John Mashey Silicon Graphics
Richard Karpinski Maqc Jack Mills Intel
Publications Alan Smith U.C. Berkeley
David Moberly Hewlett-Packard Kazuaki Murakami Kyushu Univ.
Local Arrangements Kunle Olukotun Stanford Univ.
Amr Zaky Silicon Graphics Gert Slavenburg Philips Research
Bob Lashley Sun Microsystems Marc Tremblay Sun Microsystems
Dave Gallaher SFSFC John Wharton Applications
Research
Alan Alcorn Interval Research
At Large
Bob Stewart SRE
Martin Freeman Phillips Research
Slava Mach SCVCS Chair
Carey Kornfeld Kdesign
-----------------
Location:
Hot Chips and Hot Interconnects will be held in Meorial Auditorium
on the campus of Stanford University, Palo Alto, California,
approximately 24 miles from San Francisco airport,
and 15 miles from San Jose airport.
Driving Directions:
From San Francisco, take highway 101 south
From San Jose, take highway 101 north
Take the Embarcadero exit west and go 3 miles until you enter
the Stanford campus.
Signs will then point you to conference parking.
Maps of Stanford campus and surrounding areas are available at
http://www.stanford.edu/home/visitors/maps.html
Mass transit information is available at http://www.transitinfo.org/
Weather:
Mid-August is typically in the 80s(F) and sunny during the day.
Nights are much cooler; a light jacket or sweater is appropriate.
Housing:
Hotel information for the area is available at
http://soi.stanford.edu/general/meetings/hotel.html or
http://www.stanford.edu/dept/hds/chs/general/hotel.html or
http://www-csli.stanford.edu/~clrf/hotel.html
The closest hotel is the Palo Alto Holiday Inn.
Reservations well in advance are advised.
On-campus housing is also available in student residences, and can
be arranged by contacting the Stanford Conference Office at
(650) 725-1429 or tcup@leland.stanford.edu.
Rates are $45.00 per night for single occupancy
and $32.00 per night per person for shared occupancy.
Conference registration includes:
€ attendance
€ one copy of notes
€ two luncheons
€ coffee breaks
€ Sunday afternoon wine and cheese reception (Hot Chips only)
€ Thursday (HotInterconnects)/Monday (HotChips) evening reception
€ parking
Tutorial registration includes:
€ attendance for one (HotInterconnects) or both (HotChips) tutorials
€ one copy of notes
€ luncheon
€ coffee breaks
€ Sunday afternoon wine and cheese reception (Hot Chips only)
€ parking
Registration can be done through our secure web server at http://hot.org.
Web registration is preferred, but the form below can also be mailed to:
12340 Indian Trail Rd., Los Gatos, CA 95033-8241 or faxed to (408) 867-5831.
We accept Visa or Mastercard, or checks if registering by mail.
Registrants will be sent a confirmation by email.
Refunds due to cancellations will only be made prior to August 6,
and will incur a service charge of $25.
Students must supply a copy of their school's ID card.
For answers to questions about registration, contact us by email at
registration@hoti.org or registration@hotchips.org.
For other information, contact us by email at info@hoti.org or
info@hotchips.org.
***********************************************
* Allen J. Baum tel. (650)853-6626 *
* Compaq Computers fax. (650)853-6513 *
* 181 Lytton Ave. *
* Palo Alto, CA 94301 abaum@pa.dec.com *
***********************************************
--------------4647623079E7D16E8354CD54--